Element having microstructure and manufacturing method thereof

ABSTRACT

A method of manufacturing an element having a microstructure of an excellent grating groove pattern or the like is obtained. This method of manufacturing an element having a microstructure comprises steps of forming a metal layer on a substrate, forming a dot column of concave portions on the surface of the metal layer and anodically oxidizing the surface of the metal layer formed with the dot column of concave portions while opposing this surface to a cathode surface thereby forming a metal oxide film having a grating groove pattern. When the interval between the concave portions of the dot column is reduced, therefore, a linear grating groove pattern having a large depth with a uniform groove width along the depth direction is easily formed in a self-organized manner.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an element having a microstructure anda method of manufacturing the same, and more particularly, it relates toan element having a microstructure formed by anodic oxidation and amethod of manufacturing the same.

2. Description of the Background Art

In general, a method employing photolithography and etching or a methodemploying anodic oxidation is known as a method of manufacturing amicrostructure of a micro lattice pattern or the like. In recent years,an element having a micro grating groove pattern such as an opticalelement has been implemented through photolithography and etching.

FIG. 45 is a perspective view showing the concept of a conventional waveplate (polarization element) 100 serving as an element having amicrostructure. In the conventional wave plate 100, groove patternsconstituting a grating are formed on a glass substrate 101, as shown inFIG. 45. The grating groove patterns are formed by air layers 102 andsubstrate material layers 103, having a width a, consisting of the samematerial as the glass substrate 101. The grating groove patterns have aperiod P not more than the wavelength of light. It is assumed that therefractive indices of the air layers 102 and the substrate materiallayers 103 (the glass substrate 101) are 1 and n respectively. Whenlight is incident upon the grating groove patterns of the wave plate100, the wave plate 100 exhibits an effective refractive indexcorresponding to the mixture of the refractive indices 1 and n of theair layers 102 and the substrate material layers 103.

FIG. 46 is a correlation diagram showing the relation between theeffective refractive index and the duty ratio of the conventional waveplate (polarization element) 100 shown in FIG. 45. Referring to FIG. 46,the vertical axis shows the effective refractive index, and thehorizontal axis shows the duty ratio (a/P), i.e., the ratio of the widtha of the substrate material layers 103 to the period P of the grating.Further, symbol TE denotes light having a direction of polarizationparallel to the extensional direction of the grating groove patterns, asshown in FIG. 45. Symbol TM denotes light having a direction ofpolarization perpendicular to the extensional direction of the gratinggroove patterns, as shown in FIG. 45.

Referring to FIG. 46, the effective refractive index varies with theduty ratio of the grating groove patterns. In this case, the effectiverefractive index of the light TE having the direction of polarizationparallel to the grating groove patterns differs from that of the lightTM having the direction of polarization perpendicular to the gratinggroove patterns. The characteristic of the effective refractive indexvarying with the direction of polarization of light is referred to as abirefringence property. Generally known is a polarization-dependentdiffraction grating (polarization-dependent diffraction element) capableof presenting no refractive index modulation with respect to lighthaving a prescribed direction of polarization while presentingrefractive index modulation only with respect to light having adirection of polarization perpendicular to the prescribed direction ofpolarization of the said light. The conventional polarization-dependentdiffraction grating is now described.

FIG. 47 is a plan view showing grating groove patterns of a conventionalpolarization-dependent diffraction grating (polarization-dependentdiffraction element) having a microstructure. Referring to FIGS. 46 and47, rectilinear grating groove patterns 100 a and rectilinear gratinggroove patterns 100 b extending substantially perpendicularly to thegrating groove patterns 100 a are alternately formed on a glasssubstrate 101 in the conventional polarization-dependent diffractiongrating. The grating groove patterns 10 a and 100 b have different dutyratios D1 (=(P−W1)/P) and D2 (=(P−W2)/P) respectively. The gratinggroove patterns 100 a and 100 b have the same period P. In other words,the duty ratios D1 and D2 of the grating groove patterns 10 a and 100 bare adjusted by adjusting the widths W1 and W2 of grooves of the gratinggroove patterns 100 a and 100 b respectively.

When light having a direction TE of polarization parallel to the gratinggroove patterns 100 a having the duty ratio D1 is incident, thedirection of this light is a direction TM of polarization perpendicularto the grating groove patterns 100 b in the grating groove patterns 100b having the duty ratio D2. Therefore, both the effective refractiveindices of the grating groove patterns 100 a and 100 b having the dutyratios D1 and D2 correspond to N5, as shown in FIG. 46. When lighthaving the direction TM of polarization perpendicular to the gratinggroove patterns 100 a having the duty ratio D1 is incident, on the otherhand, the direction of this light is the direction TE of polarizationparallel to the grating groove patterns 100 b in the grating groovepatterns 100 b having the duty ratio D2. Therefore, the effectiverefractive indices of the grating groove patterns 100 a and 100 b havingthe duty ratios D1 and D2 correspond to N4 and N6 respectively, as shownin FIG. 46. Thus, the effective refractive indices of the grating groovepatterns 100 a and 100 b having the duty ratios D1 and D2 can be equallyset to the level N5 with respect to the light having the direction TE ofpolarization parallel to the grating groove patterns 100 a, whereby thegrating groove patterns 100 a and 100 b can be brought into a state(transparent) exhibiting no refractive index modulation only withrespect to the light having the direction TE of polarization parallel tothe grating groove patterns 100 a.

As a manufacturing process for the rectilinear grating groove patternsof the conventional wave plate 100 shown in FIG. 45 or the rectilineargrating groove patterns 100 a and 100 b of the conventionalpolarization-dependent diffraction grating shown in FIG. 47, a method offorming rectilinear grating groove patterns by etching the surface of aglass substrate by photolithography and etching is conceivable, forexample.

In the case of forming the rectilinear grating groove patterns of theconventional wave plate 100 shown in FIG. 45 or the rectilinear gratinggroove patterns 100 a and 100 b of the conventionalpolarization-dependent diffraction grating shown in FIG. 47 byphotolithography and etching, however, it is difficult to form gratinggroove patterns having a large depth with a uniform groove width alongthe depth direction. More specifically, rectilinear grating groovepatterns deeply formed by photolithography and etching have trapezoidalsections non-uniform in the depth direction as shown in FIG. 48, andhence duty ratios in upper and lower portions of the grating groovepatterns disadvantageously differ from each other. Consequently, it isdifficult to form an element having a microstructure of excellentgrating groove patterns or the like, and hence it is disadvantageouslydifficult to obtain an optical element having an excellent birefringenceproperty.

H. Masuda et al., “Appl. Phys. Lett.”, Vol. 71 (19), Nov. 10, 1997, pp.2770-2772 discloses a process of manufacturing a triangular latticepattern employing anodic oxidation. The process of manufacturing atriangular lattice pattern disclosed in this literature, capable offorming a triangular lattice pattern having deep and uniform micropores,is proposed as a process of preparing a two-dimensional photoniccrystal. More specifically, a valve metal such as aluminum, titanium ortantalum or a semiconductor such as Si or GaAs has such a characteristicthat an oxide film having micropores arranged-perpendicular to the filmsurface is formed when an anode is electrified in an acidic electrolyte.In particular, an oxide film of aluminum has such a materialcharacteristic that micropores are easily arranged in the form of atriangular lattice. A triangular lattice pattern having deep and uniformmicropores can be formed through this characteristic.

FIGS. 49 to 52 are sectional views for illustrating a conventionalprocess of manufacturing a triangular lattice pattern by anodicoxidation. FIG. 53 is a plan view showing a two-dimensional photoniccrystal. The conventional process of manufacturing a triangular latticepattern by anodic oxidation is now described with reference to FIGS. 49to 53.

In the conventional process of manufacturing a triangular latticepattern by anodic oxidation, projecting portions 116 a arranged in theform of a triangular lattice are formed on the surface of a press member116 consisting of a hard material such as SiC, as shown in FIG. 49.Texturing is performed by pressing the press member 116 against thesurface of an aluminum material 115. Thus, concave portions 115 aarranged in the form of a triangular lattice are formed on the surfaceof the aluminum material 115, as shown in FIG. 50. Then, the aluminummaterial 115 formed with the concave portions 115 a is oxidized in anelectrolyte 119, as shown in FIG. 51. In this case, a cathode 118 isprepared from platinum or the like, and the electrolyte 119 is preparedfrom an aqueous solution of sulfuric acid, oxalic acid or phosphoricacid. Thus, an aluminum oxide (alumina) film 113 having deep and uniformmicropores 113, starting from the concave portions 115 a, arranged inthe form of a triangular lattice is formed in a self-organized manner,as shown in FIGS. 52 and 53. The micropores 113 a can be formed to havea depth of at least 10 μm with respect to submicron diameters.

However, the aforementioned conventional method of manufacturing atriangular lattice pattern by anodic oxidation has been known as amethod of forming two-dimensional photonic crystal micropores. Ingeneral, therefore, there has been no attempt of forming linear gratinggroove patterns shown in FIGS. 45 or 47 by anodic oxidation.

As hereinabove described, it has been difficult to form a linear gratinggroove pattern having a large depth with a uniform groove width alongthe depth direction in general, and hence it has been difficult to forman element having a microstructure of an excellent grating groovepattern or the like.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method ofmanufacturing an element having a microstructure of an excellent gratinggroove pattern or the like.

Another object of the present invention is to provide an element havinga microstructure of an excellent grating groove pattern or the like.

In order to attain the aforementioned objects, the inventors have madedeep study to find out that a linear grating groove pattern having auniform groove width along the depth direction can be formed byconventional anodic oxidation. The specific contents of the presentinvention are now described.

A method of manufacturing an element having a microstructure accordingto a first aspect of the present invention comprises steps of forming ametal layer on a substrate, forming a dot column of concave portions onthe surface of the metal layer and anodically oxidizing the surface ofthe metal layer formed with the dot column of concave portions whileopposing this surface to a cathode surface thereby forming a metal oxidefilm having a linear grating groove pattern.

In the method of manufacturing an element having a microstructureaccording to the first aspect, the surface of the metal layer formedwith the dot column of concave portions is anodically oxidized in thestate opposed to the cathode surface as hereinabove described, wherebythe linear grating groove pattern having a large depth with a uniformgroove width along the depth direction can be easily formed in aself-organized manner when the interval between the concave portions ofthe dot column is reduced. Consequently, an element having amicrostructure of an excellent grating groove pattern or the like can beeasily formed. When the method of manufacturing an element according tothe first aspect is applied to formation of an optical element servingas an exemplary element having a microstructure in this case, an opticalelement having an excellent birefringence property can be easily formed.

In the aforementioned method of manufacturing an element having amicrostructure according to the first aspect, the step of forming thedot column of concave portions preferably includes a step of forming thedot column of concave portions with deviation from a position forforming a triangular lattice. According to this structure, the positionfor forming the triangular lattice can be prevented from formation ofpores, whereby the pores can be prevented from formation in portionsother than grating grooves. Thus, a more excellent element having amicrostructure of a grating groove pattern or the like can be formed.When this structure is applied to an optical element serving as anexemplary element having a microstructure, the refractive index thereofis not disadvantageously changed due to light incident upon pores formedon portions other than the grating grooves.

In the aforementioned method of manufacturing an element having amicrostructure according to the first aspect, the step of forming themetal oxide film having the grating groove pattern preferably includes astep of anodically oxidizing the surface of the metal layer formed withthe dot column while opposing this surface to the cathode surfacethereby forming pores corresponding to the dot column and thereafterenlarging the pores corresponding to the dot column by etching therebyforming the metal oxide film having the grating groove pattern.According to this structure, adjacent ones of the pores are connectedwith each other due to enlargement of the pores corresponding to the dotcolumn, whereby a microstructure of an excellent grating groove patternor the like having adjacent pores connected with each other can befurther easily formed.

The aforementioned method of manufacturing an element having amicrostructure according to the first aspect preferably furthercomprises a step of forming a transparent conductor film on thesubstrate in advance of the step of forming the metal layer on thesubstrate. According to this structure, the transparent conductor filmserves as an electrode when the metal layer is anodically oxidized forforming the metal oxide film, whereby the metal layer can be completelyoxidized also when the substrate has an irregular surface. Thus, themetal layer can be prevented from forming unoxidized portions.

In the aforementioned method of manufacturing an element having amicrostructure according to the first aspect, the step of forming themetal oxide film having the linear grating groove pattern preferablyincludes a step of forming the metal oxide film having a rectilineargrating groove pattern. According to this structure, an element havingan excellent rectilinear grating groove pattern can be easily formed.

In the aforementioned method of manufacturing an element having amicrostructure according to the first aspect, the step of forming themetal oxide film having the linear grating groove pattern preferablyincludes a step of forming the metal oxide film having a curvilineargrating groove pattern. According to this structure, an element havingan excellent curvilinear grating groove pattern can be easily formed.

A method of manufacturing an element having a microstructure accordingto a second aspect of the present invention comprises steps of forming ametal layer on a substrate, periodically forming mask layers on thesurface of the metal layer and anodically oxidizing the surface of themetal layer formed with the mask layers while opposing this surface to acathode surface thereby forming a metal oxide film having a lineargrating groove pattern.

In the method of manufacturing an element having a microstructureaccording to the second aspect, the mask layers are periodically formedon the surface of the metal layer and the surface of the metal layer isthereafter anodically oxidized in the state opposed to the cathodesurface thereby forming the metal oxide film having the linear gratinggroove pattern as hereinabove described, whereby the linear gratinggroove pattern having a large depth with a uniform groove width alongthe depth direction can be easily formed only on a region formed with nomask layer in a self-organized manner. Consequently, an element having amicrostructure of an excellent grating groove pattern or the like can beeasily formed. When the method of manufacturing an element according tothe second aspect is applied to formation of an optical element servingas an exemplary element having a microstructure in this case, an opticalelement having an excellent birefringence property can be easily formed.Further, the mask layers are so formed as to prevent portions (regionsformed with the mask layer) other than grating grooves from formingpores, whereby the refractive index is not disadvantageously changed dueto light incident upon pores formed in portions other than the gratinggrooves.

In the aforementioned method of manufacturing an element having amicrostructure according to the second aspect, the step of forming themetal oxide film having the grating groove pattern preferably includes astep of anodically oxidizing the surface of the metal layer formed withthe mask layers while opposing this surface to the cathode surfacethereby forming micropores on the surface of the metal oxide film formedwith no mask layers and thereafter enlarging the micropores by etchingthereby forming the metal oxide film having the grating groove pattern.According to this structure, adjacent ones of the pores are connectedwith each other due to enlargement of the micropores formed through themetal oxide film, whereby a microstructure of an excellent gratinggroove pattern or the like having adjacent pores connected with eachother can be further easily formed.

The aforementioned method of manufacturing an element having amicrostructure according to the second aspect preferably furthercomprises a step of etching the metal layer through mask of the masklayers thereby forming etching grooves in advance of the step of formingthe metal oxide film having the grating groove pattern. According tothis structure, an electric field is, easily distorted in step portionsformed by the etching grooves, whereby micropores are easily formed onthe step portions of the etching grooves located on the boundariesbetween the regions formed with the mask layers and the etching grooves.Thus, accuracy for positions for forming the micropores can be improved.

In this case, the width of the etching grooves and the width of the masklayers are set to satisfy a relational expression L≠2S assuming that Srepresents the width of the etching grooves and L represents the widthof the mask layers respectively. According to this structure, virtualpositions of pores forming a triangular lattice can be prevented fromcoinciding, whereby the regions formed with the mask layers can beinhibited from forming of micropores.

The aforementioned method of manufacturing an element having amicrostructure according to the second aspect preferably furthercomprising a step of forming a transparent conductor film on thesubstrate in advance of the step of forming the metal layer on thesubstrate. According to this structure, the transparent conductor filmserves as an electrode when the metal layer is anodically oxidized forforming the metal oxide film, whereby the metal layer can be completelyoxidized also when the substrate has an irregular surface. Thus, themetal layer can be prevented from forming unoxidized portions.

In the aforementioned method of manufacturing an element having amicrostructure according to the second aspect, the step of forming themetal oxide film having the linear grating groove pattern preferablyincludes a step of forming the metal oxide film having a rectilineargrating groove pattern. According to this structure, an element havingan excellent rectilinear grating groove pattern can be easily formed.

In the aforementioned method of manufacturing an element having amicrostructure according to the second aspect, the step of forming themetal oxide film having the linear grating groove pattern preferablyincludes a step of forming the metal oxide film having a curvilineargrating groove pattern. According to this structure, an element havingan excellent curvilinear grating groove pattern can be easily formed.

A method of manufacturing an element having a microstructure accordingto a third aspect of the present invention comprises steps of forming ametal layer on a substrate, anodically oxidizing the surface of themetal layer while opposing this surface to a cathode surface therebyforming a metal oxide film having micropores, periodically forming masklayers on the surface of the metal oxide film and enlarging themicropores in a region formed with no mask layer through masks of themask layers by etching thereby forming a metal oxide film having alinear grating groove pattern.

In the method of manufacturing an element having a microstructureaccording to the third aspect, the surface of the metal layer isanodically oxidized in the state opposed to the cathode surface therebyforming the metal oxide film having micropores and the mask layers areperiodically formed on the surface of the metal oxide film so that themask layers are employed as masks for enlarging micropores by etching inthe region formed with no mask layer as hereinabove described, wherebyadjacent ones of the pores are connected with each other due toenlargement of the micropores in the region formed with no mask layerand hence the linear grating groove pattern having a large depth with auniform groove width along the depth direction can be formed only on theregion formed with no mask layer. Consequently, an element having amicrostructure of an excellent grating groove pattern or the like can beeasily formed. When the method of manufacturing an element according tothe third aspect is applied to formation of an optical element servingas an exemplary element having a microstructure in this case, an opticalelement having an excellent birefringence property can be easily formed.

In the aforementioned method of manufacturing an element having amicrostructure according to the third aspect, the step of forming themetal oxide film having micropores preferably includes a step of formingthe metal oxide film having micropores arranged in the form of atriangular lattice. According to this structure, dimensional accuracy ofthe grating groove pattern formed by coupling the micropores with eachother can be improved as compared with a case of forming micropores atrandom.

The aforementioned method of manufacturing an element having amicrostructure according to the third aspect preferably furthercomprises a step of forming a transparent conductor film on thesubstrate in advance of the step of forming the metal layer on thesubstrate. According to this structure, the transparent conductor filmserves as an electrode when the metal layer is anodically oxidized forforming the metal oxide film, whereby the metal layer can be completelyoxidized also when the substrate has an irregular surface. Thus, themetal layer can be prevented from forming of unoxidized portions.

In the aforementioned method of manufacturing an element having amicrostructure according to the third aspect, the step of forming themetal oxide film having the linear grating groove pattern preferablyincludes a step of forming the metal oxide film having a rectilineargrating groove pattern. According to this structure, an element havingan excellent rectilinear grating groove pattern can be easily formed.

In the aforementioned method of manufacturing an element having amicrostructure according to the third aspect, the step of forming themetal oxide film having the linear grating groove pattern preferablyincludes a step of forming the metal oxide film having a curvilineargrating groove pattern. According to this structure, an element havingan excellent curvilinear grating groove pattern can be easily formed.

A method of manufacturing an element having a microstructure accordingto a fourth aspect of the present invention comprises steps of forming ametal layer on a substrate, forming a dot column of concave portions onthe surface of the metal layer and anodically oxidizing the surface ofthe metal layer formed with the dot column of concave portions whileopposing this surface to a cathode surface thereby forming a metal oxidefilm having a rectilinear grating groove pattern.

In the method of manufacturing an element having a microstructureaccording to the fourth aspect, the surface of the metal layer formedwith the dot column of concave portions is anodically oxidized in thestate opposed to the cathode surface for forming the metal oxide filmhaving the rectilinear grating groove pattern as hereinabove described,whereby the rectilinear grating groove pattern having a large depth witha uniform groove width along the depth direction can be easily formed ina self-organized manner when the interval between the concave portionsof the dot column is reduced. Consequently, an element having amicrostructure of an excellent rectilinear grating groove pattern or thelike can be easily formed. When the method of manufacturing an elementaccording to the fourth aspect is applied to formation of an opticalelement serving as an exemplary element having a microstructure in thiscase, an optical element having an excellent birefringence property canbe easily formed.

A method of manufacturing an element having a microstructure accordingto a fifth aspect of the present invention comprises steps of forming ametal layer on a substrate, forming a dot column of concave portions ona side surface of the metal layer and anodically oxidizing the sidesurface of the metal layer formed with the dot column of concaveportions while opposing this side surface to a cathode end therebyforming a metal oxide film having a lattice pore pattern extendingsubstantially in parallel with the surface of the substrate.

In the method of manufacturing an element having a microstructureaccording to the fifth aspect, the side surface of the metal layerformed with the dot column of concave portions is anodically oxidized inthe state opposed to the cathode end for forming the metal oxide filmhaving a lattice pore pattern extending substantially in parallel withthe surface of the substrate as hereinabove described, whereby amicropore pattern extending substantially in parallel with the substrateand having a uniform pore size along the depth direction can be easilyformed in a self-organized manner. Consequently, an element having amicrostructure of an excellent micropore pattern or the like can beeasily formed. When the method of manufacturing an element according tothe fifth aspect is applied to formation of an optical element servingas an exemplary element having a microstructure and introducing lightperpendicularly to the surface of the metal oxide film, the effectiverefractive index can be varied with light having a direction ofpolarization parallel to the extensional direction of the microporepattern and with light having a direction of polarization perpendicularto the extensional direction of the micropore pattern.

An element having a microstructure according to a sixth aspect of thepresent invention comprises a substrate and a metal oxide film, formedon the substrate, having a linear grating groove pattern.

In the element having a microstructure according to the sixth aspect,the metal oxide film having a linear grating groove pattern is formed onthe substrate as hereinabove described, whereby the linear gratinggroove pattern having a large depth with a uniform groove width alongthe depth direction can be easily formed in a self-organized manner whenthe metal oxide film is formed by anodic oxidation, so that the elementcan be easily formed with a microstructure of an excellent gratinggroove pattern or the like. When the structure according to the sixthaspect is applied to an optical element serving as an exemplary elementhaving a microstructure, an optical element having an excellentbirefringence property can be easily obtained.

In the aforementioned element having a microstructure according to thesixth aspect, the linear grating groove pattern preferably includes apore column pattern formed by linearly coupling micropores with eachother. According to this structure, the microstructure of a gratinggroove pattern or the like of linearly can be easily formed by linearlycoupling micropores with each other by conventional anodic oxidation forforming a microporp pattern.

The aforementioned element having a microstructure according to thesixth aspect preferably further comprises a transparent conductor filmformed between the substrate and the metal oxide film. According to thisstructure, the transparent conductor film serves as an electrode whenthe metal layer is anodically oxidized for forming the metal oxide film,whereby the metal layer can be completely oxidized also when thesubstrate has an irregular surface. Thus, the metal layer can beprevented from forming of unoxidized portions.

In the aforementioned element having a microstructure according to thesixth aspect, the linear grating groove pattern preferably includes arectilinear grating groove pattern. According to this structure, anelement having an excellent rectilinear grating groove pattern can beeasily obtained.

In the aforementioned element having a microstructure according to thesixth aspect, the linear grating groove pattern preferably includes acurvilinear grating groove pattern. According to this structure, anelement having an excellent curvilinear grating groove pattern can beeasily obtained.

In the aforementioned element having a microstructure according to thesixth aspect, the linear grating groove pattern preferably includes alinear first groove pattern extending in a first direction and a linearsecond groove pattern extending in a direction substantiallyperpendicular to the first groove pattern, and the first groove patternand the second groove pattern may be alternately formed. According tothis structure, diffraction gratings having different polarizationdependencies can be prepared when the element according to the sixthaspect is applied to an optical element serving as an exemplary elementhaving a microstructure. When adjusting the duty ratios of the first andsecond groove patterns, therefore, the refractive indices of the firstand second groove patterns can be equalized with each other only withrespect to light having a direction of polarization perpendicular to thefirst groove pattern, for example, whereby the first and second groovepatterns can be brought into a state (transparent) exhibiting norefractive index modulation. Thus, an excellent extinction ratio can beobtained. Further, the first and second groove patterns can be formed tohave uniform groove widths by anodic oxidation, so that duty ratios ofupper and lower portions are uniform. Consequently, a further excellentextinction ratio can be obtained.

In the aforementioned element having a microstructure according to thesixth aspect, the metal oxide film having the linear grating groovepattern is preferably used for any of a polarization element, apolarization-dependent diffraction element and a multilayer filmelement. According to this structure, a polarization element, apolarization-dependent diffraction element or a multilayer film elementhaving a grating groove pattern can be easily obtained.

An element having a microstructure according to a seventh aspect of thepresent invention comprises a substrate and a metal oxide film, formedon the substrate, having a rectilinear grating groove pattern.

In the element having a microstructure according to the seventh aspect,the metal oxide film having a rectilinear grating groove pattern isformed on the substrate as hereinabove described, whereby therectilinear grating groove pattern having a large depth with a uniformgroove width along the depth direction can be easily formed in aself-organized manner when the metal oxide film is formed by anodicoxidation, so that an element having a microstructure of an excellentrectilinear grating groove pattern or the like can be easily obtained.When the structure according to the seventh aspect is applied to anoptical element serving as an exemplary element having a microstructure,an optical element having an excellent birefringence property can beeasily obtained.

The foregoing and other objects, features, aspects and advantages of thepresent invention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are sectional views for illustrating a process ofmanufacturing a wave plate (polarization element) as an element having amicrostructure according to a first embodiment of the present invention;

FIG. 3 is a plan view for illustrating the process of manufacturing thewave plate (polarization element) as the element having a microstructureaccording to the first embodiment of the present invention;

FIGS. 4 and 5 are sectional views for illustrating the process ofmanufacturing the wave plate (polarization element) as the elementhaving a microstructure according to the first embodiment of the presentinvention;

FIGS. 6 and 7 are plan views for illustrating the process ofmanufacturing the wave plate (polarization element) as the elementhaving a microstructure according to the first embodiment of the presentinvention;

FIG. 8 is a perspective view showing the structure of a quarter-waveplate as an exemplary element (pollarization element) having amicrostructure according to the first embodiment of the presentinvention;

FIG. 9 is a plan view showing grating groove patterns of apolarization-dependent diffraction grating (polarization-dependentdiffraction element) as an element having a microstructure according toa modification of the first embodiment;

FIGS. 10 to 12 are plan views for illustrating a process ofmanufacturing grating groove patterns of a wave plate (polarizationelement) as an element having a microstructure according to a secondembodiment of the present invention;

FIGS. 13 to 15 are plan views for illustrating a process ofmanufacturing grating groove patterns of a wave plate (polarizationelement) as an element having a microstructure according to a thirdembodiment of the present invention;

FIG. 16 is a sectional view for illustrating a process of manufacturinggrating groove patterns of a wave plate (polarization element) as anelement having a microstructure according to a fourth embodiment of thepresent invention;

FIG. 17 is a perspective view for illustrating the process ofmanufacturing the grating groove patterns of the wave plate(polarization element) as the element having a microstructure accordingto the fourth embodiment of the present invention;

FIG. 18 is a sectional view for illustrating the process ofmanufacturing the grating groove patterns of the wave plate(polarization element) as the element having a microstructure accordingto the fourth embodiment of the present invention;

FIGS. 19 and 20 are perspective views for illustrating the process ofmanufacturing the grating groove patterns of the wave plate(polarization element) as the element having a microstructure accordingto the fourth embodiment of the present invention;

FIGS. 21 to 23 are sectional views for illustrating a process ofmanufacturing grating groove patterns of a wave plate (polarizationelement) as an element having a microstructure according to a sixthembodiment of the present invention;

FIG. 24 is a plan view for illustrating positions of pores formed uponoxidation;

FIG. 25 is a plan view for illustrating the process of manufacturing thegrating groove patterns of the wave plate (polarization element) as theelement having a microstructure according to the sixth embodiment of thepresent invention;

FIGS. 26 is a sectional view for illustrating the process ofmanufacturing the grating groove patterns of the wave plate(polarization element) as the element having a microstructure accordingto the sixth embodiment of the present invention;

FIG. 27 is a perspective view showing a polarization-dependentdiffraction grating (polarization-dependent diffraction element) as anelement having a microstructure according to a modification of the sixthembodiment;

FIG. 28 is a plan view showing grating groove patterns of thepolarization-dependent diffraction grating according to the sixthembodiment shown in FIG. 27;

FIG. 29 is a correlation diagram showing the relation between theeffective refractive index and the period of the polarization-dependentdiffraction grating according to the sixth embodiment shown in FIG. 27;

FIGS. 30 and 31 are plan views for illustrating a process ofmanufacturing grating groove patterns of a wave plate (polarizationelement) as an element having a microstructure according to a seventhembodiment of the present invention;

FIG. 32 is a sectional view taken along the line 500-500 in FIG. 31;

FIG. 33 is a plan view for illustrating the process of manufacturing thegrating groove patterns of the wave plate (polarization element) as theelement having a microstructure according to the seventh embodiment ofthe present invention;

FIG. 34 is a sectional view taken along the line 600-600 in FIG. 33;

FIGS. 35 and 36 are plan views for illustrating a process ofmanufacturing grating groove patterns of a wave plate (polarizationelement) as an element having a microstructure according to amodification of the seventh embodiment;

FIG. 37 is a sectional view taken along the line 700-700 in FIG. 36;

FIG. 38 is a plan view for illustrating the process of manufacturing thegrating groove patterns of the wave plate (polarization element) as theelement having a microstructure according to the modification of theseventh embodiment;

FIG. 39 is a sectional view taken along the line 800-800 in FIG. 38;

FIG. 40 is a perspective view showing the structure of a waveguidefilter prepared by a method of manufacturing a microstructure accordingto the present invention;

FIGS. 41 to 44 are plan views showing examples of the shapes of gratinggroove patterns formable by the method of manufacturing a microstructureaccording to the present invention;

FIG. 45 is a perspective view showing a wave plate (polarizationelement) as an exemplary conventional element having a microstructure;

FIG. 46 is a correlation diagram showing the relation between theeffective refractive index and the duty ratio of the conventional waveplate (polarization element) shown in FIG. 45;

FIG. 47 is a plan view showing grating groove patterns of apolarization-dependent diffraction grating (polarization-dependentdiffraction element) as another exemplary conventional element having amicrostructure;

FIG. 48 is a sectional view of a conventional element having gratinggroove patterns formed by photolithography and etching;

FIGS. 49 to 52 are sectional views for illustrating a conventionalprocess of manufacturing a triangular lattice pattern by anodicoxidation; and

FIG. 53 is a plan view showing a conventional two-dimensional photoniccrystal formed by anodic oxidation.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention are now described with reference tothe drawings.

First Embodiment

A process of manufacturing a wave plate according to a first embodimentof the present invention is described with reference to FIGS. 1 to 7.

First, a transparent electrode film 2 consisting of ITO or ZnO and analuminum film 3 having a thickness of about 3 μm are successively formedon a glass substrate 1 by vapor deposition, as shown in FIG. 1. Theglass substrate 1 is an example of the “substrate” in the presentinvention, and the transparent electrode film 2 is an example of the“transparent conductor film” in the present invention. The aluminum film3 is an example of the “metal layer” in the present invention.

As shown in FIG. 2, regularly arranged projecting portions 4 a areformed on the surface of a press member 4 consisting of a hard materialsuch as SiC, in order to perform texturing. According to the firstembodiment, the projecting portions 4 a (see FIG. 2) of the press member4 are so formed as to define dot columns of concave portions 3 a on thesurface of the textured aluminum film 3 every other column of aplurality of triangular lattice patterns 5 shown by broken lines. Thepress member 4 is pressed against the surface of the aluminum film 3 bytexturing as shown in FIG. 2, thereby forming the dot columns of theconcave portions 3 a on the surface of the aluminum film 3 in thearrangement shown in FIG. 3.

As shown in FIG. 4L the aluminum film 3 formed with the dot columns ofthe concave portions 3 a (see FIG. 3) is anodically oxidized therebyforming pores (not shown) corresponding to the dot columns. Morespecifically, the surface of the aluminum film 3 serving as an anode isopposed to the surface of a cathode 6 consisting of platinum. A voltageof about 30 V is applied in aqueous sulfuric acid 7 of about 5% inconcentration thereby performing oxidation for about 20 minutes.According to the first embodiment, the voltage is applied to thealuminum film 3 through the transparent electrode film 2 formed betweenthe glass substrate 1 and the aluminum film 3. Thus, the voltage can beregularly applied to the aluminum film 3 during the oxidation, therebypreventing the aluminum film 3 from disadvantageously leaving unoxidizedportions also when the glass substrate 1 has an irregular surface. Thus,an aluminum oxide film 8 having micropores is formed in a self-organizedmanner. In relation to such micropores formed by anodic oxidation, it isknown that a relational expression U=0.0025 Va (μm) holds assuming thatU represents the maximum distance between adjacent pores and Varepresents the anodic oxidation voltage. This relational expression(U=0.0025 Va (μm)) is disclosed in H. Masuda et al., “Jpn. J. Appl.Phys.”, Vol. 37, 1998, pp. L1340-L1342, for example.

According to the first embodiment, pores corresponding to the dotcolumns formed by anodic oxidation are thereafter enlarged at about 30°C. by wet etching in an aqueous solution containing about 5 wt. % ofphosphoric acid. At this time, adjacent ones of the pores correspondingto the dot columns are connected with each other due to the enlargementof the pores as shown in FIGS. 5 and 6, whereby portions of the aluminumoxide film 8 located on regions for forming grooves 8 a can be easilysubstantially completely removed. Thus, the aluminum oxide (alumina)film 8 is formed with rectilinear grating groove patterns. The aluminumoxide film 8 is an example of the “metal oxide film” in the presentinvention. The grating groove patterns include the grooves 8 a formed byrectilinearly coupling micropores with each other. The grooves 8 a ofthe grating groove patterns are uniformly formed along the depthdirection to reach the transparent electrode film 2. Pores 9 are formedon surface portions of the aluminum oxide film 8 located between thegrooves 8 a. As shown in FIG. 7, each pore 9 is conceivably formed on aposition corresponding to each triangular lattice pattern 5 formed withno concave portion 3 a due to influence by distortion of the concaveportions 3 a formed by texturing and distortion resulting from anodicoxidation.

According to the first embodiment, the dot columns of the concaveportions 3 a shown in FIG. 3 are formed on the surface of the aluminumfilm 3, which in turn is anodically oxidized in the state opposed to thesurface of the cathode 6 consisting of platinum as hereinabovedescribed, whereby the grating groove patterns can be easily formed byrectilinearly coupling the micropores with each other by conventionalanodic oxidation for forming a micropore pattern.

According to the first embodiment, further, the grating groove patternscan be formed to include the grooves 8 a having uniform widths in upperand lower portions through anodic oxidation, whereby the duty ratios onthe upper and lower portions of the grating groove patterns can beuniformalized. Consequently, the effective refractive index can beexcellently varied with light having a direction of polarizationparallel to the extensional direction of the grating groove patterns andwith light having a direction of polarization perpendicular to theextensional direction of the grating groove patterns, thereby forming awave plate having an excellent birefringence property.

According to the first embodiment, further, the pores formed by anodicoxidation are enlarged by wet etching, whereby the grating groovepatterns can be more easily formed by rectilinearly coupling the poreswith each other.

FIG. 8 is a perspective view showing the structure of a quarter-waveplate as an exemplary polarization element having a microstructureaccording to the aforementioned first embodiment. As shown in FIG. 8, ametal oxide film 88 having rectilinear grating groove patterns 89according to the present invention is formed on a substrate 81. Linearlypolarized light A inclined by about 45° with respect to the gratinggroove patterns 89 is converted to circularly polarized light A whenperpendicularly incident upon the upper surface of the metal oxide film88.

FIG. 9 is a plan view showing a polarization-dependent diffractiongrating according to a modification of the first embodiment. Referringto FIG. 9, rectilinear grating groove patterns 10 a and rectilineargrating groove patterns lob extending in a direction substantiallyperpendicular to the grating groove patterns 10 a are alternately formedon the same glass substrate (not shown) through a process similar to theprocess of manufacturing a wave plate according to the aforementionedfirst embodiment in the polarization-dependent diffraction gratingaccording to the modification of the first embodiment. The gratinggroove patterns 10 a and 10 b are examples of the “first groove pattern”and the “second groove pattern” in the present invention respectively.Thus, polarization-dependent diffraction gratings can be prepared on theglass substrate. When the duty ratios or the periods of the gratinggroove patterns 10 a and 10 b are adjusted, the effective refractiveindices of the grating groove patterns 10 a and 10 b can be equalizedwith each other with respect to light having a direction of polarizationperpendicular to the grating groove patterns 10 a, for example, wherebythe grating groove patterns 10 a and 10 b can be brought into a state(transparent) exhibiting no refractive index modulation only withrespect to the direction of polarization perpendicular to the gratinggroove patterns 10 a. Thus, an excellent extinction ratio can beobtained. Further, the grating groove patterns 10 a and 10 b can be soformed as to uniformalize the duty ratios on the upper and lowerportions thereof similarly to the aforementioned first embodiment,whereby a further excellent extinction ratio can be obtained.

Second Embodiment

Referring to FIGS. 10 to 12, a manufacturing process according to asecond embodiment of the present invention is similar to that accordingto the aforementioned first embodiment except that positions of dotcolumns of concave portions 13 a formed on an aluminum film 13 bytexturing are different from those in the first embodiment.

In the manufacturing process according to the second embodiment,texturing is so performed as to form the dot columns of the concaveportions 13 a on the surface of the textured aluminum film 13 everyother column of triangular lattice patterns 5 arranged in a plurality ofcolumns shown by broken lines while alternating adjacent ones of the dotcolumns of the concave portions 13 a, as shown in FIG. 10. Thus, the dotcolumns of the concave portions 13a are formed on the surface of thealuminum film 13 in the arrangement shown in FIG. 10. The aluminum film13 is an example of the “metal layer” in the present invention.

According to the second embodiment, the aluminum film 13 formed with thedot columns of the concave portions 13 a thereafter is anodicallyoxidized, similarly to the aforementioned first embodiment. Thus,positions influenced by distortion of the concave portions 13 a formedby texturing and those influenced by distortion resulting from anodicoxidation can be alternated as shown in FIG. 11 in the case of anodicoxidation of the aluminum film 13 formed with the dot columns of theconcave portions 13 a having the arrangement shown in FIG. 10.Thereafter wet etching is performed for enlarging micropores formed byanodic oxidation thereby forming grating groove patterns having no poreson surface portions of an aluminum oxide film 18 located between grooves18 a as shown in FIG. 12. Consequently, the refractive index is notchanged by light incident upon pores formed in portions other than thegrooves 18 a, whereby a wave plate having a further excellentbirefringence property can be formed as compared with the firstembodiment. The aluminum oxide film 18 is an example of the “metal oxidefilm” in the present invention.

Other effects of the second embodiment are similar to those of the firstembodiment.

Third Embodiment

Referring to FIGS. 13 to 15, grating groove patterns are formed byrectilinearly coupling a larger number of micropores with each other ina manufacturing process according to a third embodiment of the presentinvention as compared with the aforementioned first and secondembodiments.

In the process of manufacturing the grating groove patterns of a waveplate according to the third embodiment, positions of dot columns ofconcave portions 23 a formed on an aluminum film 23 by texturing aredifferent from those in the aforementioned first and second embodiments,as shown in FIG. 13. More specifically, texturing is so performed as toform the dot columns of the concave portions 23 a every other column oftriangular lattice patterns 5 arranged in a plurality of columns shownby broken lines so that the interval along the column direction isnarrower than the interval between the triangular lattice patterns 5.The aluminum film 23 is an example of the “metal layer” in the presentinvention.

According to the third embodiment, the aluminum film 23 formed with thedot columns of the concave portions 23 a is thereafter anodicallyoxidized similarly to the aforementioned first and second embodiments.Thus, positions influenced by distortion of the concave portions 23 aformed by texturing and those influenced by distortion resulting fromanodic oxidation can be separated from each other as shown in FIG. 14 inthe case of anodic oxidation of the aluminum film 23 formed with the dotcolumns of the concave portions 23 a having the arrangement shown inFIG. 13. Thereafter wet etching is performed for enlarging microporesformed by anodic oxidation, thereby forming the grating groove patternswith no pores formed in surface portions of an aluminum oxide film 28located between grooves 28 a as shown in FIG. 15. Consequently, therefractive index is not changed by light incident upon pores formed inportions other than the grooves 28 a, whereby a wave plate having afurther excellent birefringence property can be formed as compared withthe first embodiment. The aluminum oxide film 28 is an example of the“metal oxide film” in the present invention.

Other effects of the third embodiment are similar to those of the firstand second embodiments.

Fourth Embodiment

Referring to FIGS. 16 to 19, a manufacturing process according to afourth embodiment of the present invention is now described withreference to grating groove patterns formed on a side surface of analuminum oxide film 38 dissimilarly to the aforementioned first to thirdembodiments.

In the process of manufacturing a wave plate according to the fourthembodiment, an aluminum film 33 having a thickness of about 3 μm isformed on a glass substrate 31 by vapor deposition, as shown in FIG. 16.The glass substrate 31 is an example of the “substrate” in the presentinvention, and the aluminum film 33 is an example of the “metal layer”in the present invention.

According to the fourth embodiment, a side surface of the aluminum film33 is polished for performing texturing. As shown in FIG. 17, dotcolumns of concave portions 33 a are formed on the side surface of thealuminum film 33 by texturing. The dot columns of the concave portions33 a are in arrangement similar to any of those according to the first,second and third embodiments shown in FIGS. 3, 10 and 12 respectively.

According to the fourth embodiment, the aluminum film 33 formed with thedot columns of the concave portions 33 a is thereafter anodicallyoxidized thereby forming pores (not shown) corresponding to the dotcolumns, as shown in FIG. 18. More specifically, the side surface of thealuminum film 33 serving as an anode is opposed to a side surface of acathode 36 consisting of platinum. A voltage of about 30 V is applied inaqueous sulfuric acid 37 of about 5% in concentration thereby performingoxidation for about 120 minutes. Thereafter pores corresponding to thedot columns formed by oxidation are enlarged by wet etching, similarlyto the aforementioned first embodiment. At this time, portions of thealuminum oxide film 38 located on regions for forming grooves 38 a aresubstantially completely removed, as shown in FIG. 19. Thus, thealuminum oxide film 38 having rectilinear grating groove patternsincluding the grooves 38 a is formed in a self-organized manner. Thealuminum oxide film 38 is an example of the “metal oxide film” in thepresent invention.

In the manufacturing process according to the fourth embodiment, thegrating groove patterns can be easily formed by rectilinearly couplingmicropores with each other by conventional anodic oxidation for forminga micropore pattern by forming the regularly arranged dot columns of theconcave portions 33 a on the side surface of the aluminum film 33 whileoxidizing the side surface of the aluminum film 33 in the state opposedto the side surface of the cathode 36 consisting of platinum, ashereinabove described.

The grating groove patterns including the grooves 38 a having uniformwidths in upper and lower portions can be formed by anodic oxidation,whereby the duty ratios in the upper and lower portions of the gratinggroove patterns can be uniformalized. Consequently, the effectiverefractive index can be excellently varied with light having a directionof polarization parallel to the extensional direction of the gratinggroove patterns and with light having a direction of polarizationperpendicular to the extensional direction of the grating groovepatterns, thereby forming a wave plate having an excellent birefringenceproperty.

According to the fourth embodiment, further, the grating groove patternscan be further easily formed by rectilinearly coupling the microporeswith each other by enlarging the pores formed by anodic oxidation by wetetching.

Fifth Embodiment

Referring to FIG. 20, an aluminum oxide film 48 having patterns oftriangular lattice pores 48 a extending in a direction X substantiallyparallel to the surface of a glass substrate 41 is formed in amanufacturing process according to a fifth embodiment of the presentinvention, dissimilarly to the aforementioned first to fourthembodiments. The glass substrate 41 is an example of the “substrate” inthe present invention, and the aluminum oxide film 48 is an example ofthe “metal oxide film” in the present invention.

In the process of manufacturing a wave plate according to the fifthembodiment, triangular lattice patterns are formed by texturing,dissimilarly to the texturing according to the fourth embodiment shownin FIG. 17. The aluminum oxide film 48 having the patterns of thetriangular lattice pores 48 a extending in the direction X substantiallyparallel to the surface of the glass substrate 41 can be easily formedby thereafter carrying out a step similar to the anodic oxidation stepaccording to the fourth embodiment shown in FIG. 18. When light isincident upon the wave plate formed according to the fifth embodimentperpendicularly to the surface of the aluminum oxide film 48, therefore,the effective refractive index can be varied with light having adirection of polarization parallel to the extensional direction of thepatterns of the lattice pores 48 a and with light having a direction ofpolarization perpendicular to the extensional direction of the patternsof the lattice pores 48 a. Consequently, a wave plate having anexcellent birefringence property can be easily formed.

Sixth Embodiment

Referring to FIGS. 21 to 26, a manufacturing process according to asixth embodiment of the present invention is described with reference acase of forming grating groove patterns by periodically forming masklayers 54 on an aluminum film 53 and thereafter performing oxidationwithout texturing dissimilarly to the aforementioned first to fifthembodiments.

According to the sixth embodiment, the aluminum film 53 having aprescribed thickness is formed on a transparent substrate 51 consistingof quartz or the like by electron beam evaporation or sputtering, asshown in FIG. 21. The transparent substrate 51 is an example of the“substrate” in the present invention, and the aluminum film 53 is anexample of the “metal layer” in the present invention.

According to the sixth embodiment, the mask layers 54 of Ni having athickness of about 0.1 μm and a width L of about 0.25 μm areperiodically formed on the aluminum film 53 by a lift-off method at aninterval of about 0.1 μm, as shown in FIG. 22. More specifically, aresist film (not shown) is formed on the overall surface of the aluminumfilm 53 and thereafter periodically patterned at an interval of about0.25 μm to have a width of about 0.1 μm (period: 0.35 μm) using electronbeam lithography, reducing projection pattern exposure, or two lightbeam interference technique. Thereafter an Ni layer (not shown) having athickness of about 0.1 μm is formed to cover the resist film, and theresist film and the Ni layer located on the resist film are thereafterremoved. Thus, the mask layers 54 of Ni having the thickness of about0.1 μm and the width L of about 0.25 μm are periodically formed at theinterval of about 0.1 μm.

As shown in FIG. 23, the mask layers 54 are employed as masks forpartially removing the aluminum film 53 up to a depth of about 0.1 μmfrom the upper surface thereof by dry etching, thereby forming etchinggrooves 50 having a width S of about 0.1 μm and a depth of about 0.1 μm.The etching grooves 50 are so formed as to easily cause field distortionin steps thereof in an anodic oxidation step described later. Therefore,micropores are easily formed in regions causing field distortion,whereby accuracy in positions for forming the micropores can beimproved.

Then, the aluminum film 53 is anodically oxidized similarly to theanodic oxidation step according to the first embodiment shown in FIG. 4.According to the sixth embodiment, however, oxidation is performedemploying an electrolyte dissolving oxalic acid of about 0.1 mol inconcentration and applying a voltage of about 100 V at a temperature ofabout 3° C. Thus, an aluminum oxide film 58 having micropores 53 a and53 b is formed in a self-organized manner, as shown in FIG. 23. Thepores 53 a and 53 b are formed on the boundaries between the etchinggrooves 50 and regions 54 a formed with the mask layers 54 to formtriangular lattices (regions F enclosed with broken lines in FIG. 24).The aluminum oxide film 58 is an example of the metal oxide films in thepresent invention. The mask layers 54 of Ni are also oxidized at thistime.

In relation to pores formed by anodic oxidation, it is known that arelational expression U=0.0025 Va (μm) holds assuming that U representsthe maximum distance between adjacent pores and Va represents the anodicoxidation voltage. In order to form the pores 53 a and 53 b on theboundaries between the etching grooves 50 and the regions 54a formedwith the mask layers 54 as shown in FIG. 24, the anodic oxidationvoltage Va must be set to satisfy a relational expression 0.866U≧S. Thisrelational expression (0.866U≧S) can be derived from U=(2/{squareroot}3)×S from the relation of a triangular ratio. According to thesixth embodiment, the maximum distance U between the adjacent ones ofthe pores 53 a and 53 b is about 0.25 μm and the width S of the etchinggrooves 50 is about 0.1 μm, to satisfy the relational expression0.866U≧S. Thus, the pores 53 a and 53 b can be formed on the boundariesbetween the etching grooves 50 and the regions 54 a formed with the masklayers 54.

In order to form excellent grating groove patterns, it is important toform no pores in the regions 54 a formed with the mask layers 54, i.e.,regions other than those formed with grooves 58 a (see FIG. 25) of thegrating groove patterns described later. When virtual positions 59 a and59 b for forming the triangular lattices with the pores 53 a and 53 brespectively coincide with each other in the regions 54 a formed withthe mask layers 54 as shown in FIG. 24, pores may be formed in anodicoxidation regardless of the mask layers 54. Therefore, the regions 54 aformed with the mask layers 54 can be prevented from forming pores bypreventing the virtual positions 59 a and 59 b from coinciding with eachother. Thus, the width L of the mask layers 54 and the width S of theetching grooves 50 must be set to satisfy a relational expression L≠2S.According to the sixth embodiment, the width L of the mask layers 54 isabout 0.25 μm and the width S of the etching grooves 50 is about 0.1 μm,to satisfy the relational expression L≠2S.

The width L of the mask layers 54 must be further set to also satisfy arelational expression U≧L, to be not more than the maximum distance Ubetween adjacent ones of the pores 53 a and 53 b. If the width L doesnot satisfy this condition (U<L), the pores 53 a and 53 b located onboth ends of the mask layers 54 gradually approach to each other asgrowing in the depth direction, such that the distance therebetweenreaches the value U. Therefore, the pores 53 a and 53 b cannot be formedrectilinearly in the depth direction. According to the sixth embodiment,the maximum distance U between the adjacent ones of the pores 53 a an 53b is about 0.25 μm and the width L of the mask layers 54 is about 0.25μm, to also satisfy the relational expression U≧L.

According to the sixth embodiment, the pores 53 a and 53 b are enlargedby wet etching through the mask layers 54 with an aqueous solutioncontaining phosphoric acid by about 5 wt. % at a temperature of about30° C. At this time, the pores 53 a and 53 b (see FIG. 23) are soenlarged that adjacent ones thereof are connected with each other asshown in FIGS. 25 and 26, whereby portions of the aluminum oxide film 58located on the regions formed with the grooves 58 a can be easilysubstantially completely removed. An Ni oxide forming the mask layers 54is excellent in durability against aqueous phosphoric acid. Therefore,pores, which may be formed on the regions 54 a (see FIG. 24) formed withthe mask layers 54, can be prevented from etching. Thus, the aluminumoxide film 58 is formed with rectilinear grating groove patternsprovided on regions other than the regions 54 a formed with the masklayers 54. The grating groove patterns include the grooves 58 a formedby rectilinearly coupling the pores 53 a and 53 b with each other. Thegrooves 58 a of the grating groove patterns are formed uniformly in thedepth direction to reach the transparent substrate 51.

According to the present invention, rectilinear grating groove patternshaving a large depth with a uniform groove width along the depthdirection can be easily formed in a self-organized manner only onregions formed with no mask layers 54 by periodically forming the masklayers 54 on the aluminum film 53 and thereafter anodically oxidizingthe aluminum film 53 thereby forming the aluminum oxide film 58 havingrectilinear grating groove patterns. Consequently, a wave plate havingan excellent birefringence property can be easily formed. Further, theportions, i.e., the regions 54 a formed with the mask layers 54, otherthan the grooves 58 a of the grating groove patterns can be preventedfrom forming pores, whereby the refractive index is not changed by lightincident upon pores formed in the portions other than the grooves 58 aof the grating groove patterns.

A polarization-dependent diffraction grating according to a modificationof the sixth embodiment is described with reference to FIGS. 27 to 29.Referring to FIG. 29, the vertical axis shows the effective refractiveindex, and the horizontal axis shows a period P. Referring to FIG. 29,further, symbol TE denotes light having a direction of polarizationparallel to the extensional direction of grating groove patterns, andsymbol TM denotes light having a direction of polarization perpendicularto the extensional direction of the grating groove patterns.

FIGS. 27 to 29 shows the polarization-dependent diffraction gratingaccording to the modification of the sixth embodiment. In thispolarization-dependent diffraction grating, an aluminum oxide film 58having rectilinear grating groove patterns 50 a and rectilinear gratinggroove patterns 50 b extending in a direction substantiallyperpendicular to the grating groove patterns 50 a is formed on atransparent substrate 51 through a manufacturing process similar to theprocess of manufacturing a wave plate according to the aforementionedsixth embodiment. The grating groove patterns 50 a and 50 b arealternately formed. The grating groove patterns 50 a and 50 b areexamples of the “first groove pattern” and the “second groove pattern”in the present invention respectively. These grating groove patterns 50a and 50 b have periods P1 and P2 respectively with grooves of the samewidth W. In the modification of the sixth embodiment, thepolarization-dependent diffraction grating is prepared by adjusting theperiods P1 and P2 without adjusting the groove width W, dissimilarly tothe conventional polarization-dependent diffraction grating shown inFIG. 47.

When light A having a direction TE of polarization parallel to thegrating groove patterns 50 a having the period P1 is incident, thedirection of polarization of this light A is a direction TM ofpolarization perpendicular to the grating groove patterns 50 b in thegrating groove patterns 50 b having the period P2. Therefore, theeffective refractive indices of the grating groove patterns 50 a and 50b having the periods P1 and P2 respectively correspond to N2. When lightB having the direction TM of polarization perpendicular to the gratinggroove patterns 50 a having the period P1 is incident, on the otherhand, the direction of this light B is the direction TE of polarizationparallel to the grating groove patterns 50 b in the grating groovepatterns 50 b having the period P2. Therefore, the effective refractiveindices of the grating groove patterns 50 a and 50 b having the periodsP1 and P2 correspond to N1 and N3 respectively. Thus, the effectiverefractive indices of the grating groove patterns 50 a and 50 b havingthe periods P1 and P2 can be equally set to the value N2 with respect tothe light A having the direction TE of polarization parallel to thegrating groove patterns 50 a, whereby the grating groove patterns 50 aand 50 b can be brought into a state (transparent) exhibiting norefractive index modulation only with respect to the light A.

According to the modification of the sixth embodiment, thepolarization-dependent diffraction grating can be prepared withoutadjusting the width W of the grooves of the grating groove patterns 50 aand 50 b as hereinabove described, whereby the polarization-dependentdiffraction grating can be easily prepared through the manufacturingprocess according to the sixth embodiment allowing easy formation ofgrating groove patterns having uniform widths. Similarly to theaforementioned sixth embodiment, the rectilinear grating groove patterns50 a and 50 b can be formed to have a large depth with a uniform groovewidth along the depth direction, whereby an excellent extinction ratiocan be attained.

Seventh Embodiment

Referring to FIGS. 30 to 34, a manufacturing process according to aseventh embodiment of the present invention is described with referenceto a case of oxidizing an aluminum film before forming mask layers 54,dissimilarly to the aforementioned sixth embodiment.

According to the seventh embodiment, the aluminum film (not shown)formed on a glass substrate 51 (see FIG. 32) by electron beamevaporation or sputtering is anodically oxidized similarly to the anodicoxidation step according to the first embodiment shown in FIG. 4. In theanodic oxidation step according to the seventh embodiment, however, avoltage of about 30 V to about 50 V lower than the applied voltage(about 100 V) in the aforementioned sixth embodiment is applied. Thus,an aluminum oxide film 68 is formed with pores 63 smaller in diameterand separation than the pores 53 a and 53 b in the sixth embodimentshown in FIG. 24, as shown in FIG. 30. The pores 63 are formed at randomalong the overall region of the aluminum oxide film 68. The aluminumoxide film 68 is an example of the “metal oxide film” in the presentinvention.

According to the seventh embodiment, the mask layers 54 are thereafterperiodically formed on the aluminum oxide film 68 through a processsimilar to the step according to the sixth embodiment shown in FIG. 22,as shown in FIGS. 31 and 32. Thereafter the mask layers 54 are employedas masks for enlarging the pores 63 by wet etching under conditionssimilar to those in the aforementioned sixth embodiment. At this time,adjacent ones of the pores 63 are connected with each other due toenlargement of the pores 63 located on regions other than those formedwith the mask layers 54 as shown in FIGS. 33 and 34, whereby portions ofthe aluminum oxide film 68 located on regions formed with grooves 68 acan be easily substantially completely removed. Thus, the aluminum oxidefilm 68 is formed with rectilinear grating groove patterns. The gratinggroove patterns include the grooves 68 a formed by coupling the pores 63with each other as a belt. The grooves 68 a of the grating groovepatterns are formed uniformly along the depth direction to reach thetransparent substrate 51.

According to the seventh embodiment, the aluminum film is anodicallyoxidized thereby forming the aluminum oxide film 68 having themicropores 63 and the mask layers 54 are thereafter formed on thealuminum oxide film 68 for enlarging the micropores 63 formed in theregions formed with no mask layers 54 by etching through masks of themask layers 54 as hereinabove described, whereby the rectilinear gratinggroove patterns having a large depth with a uniform groove width alongthe depth direction can be formed only in the regions formed with nomask layers 54. Consequently, a wave plate having a birefringenceproperty can be easily formed.

According to the seventh embodiment forming the grooves 68 a of thegrating groove patterns by rectilinearly coupling the pores 63 formed atrandom with each other, the dimensional accuracy of the grooves 68 a ishard to improve. However, positions for forming the pores 63 in thealuminum oxide film 68 may not be set and hence the anodic oxidationstep can be inhibited from complication.

Referring to FIGS. 35 to 39, a modification of the seventh embodiment isdescribed with reference to a case of forming an aluminum oxide film 78having pores arranged in the form of triangular lattices in aself-organized manner dissimilarly to the aforementioned seventhembodiment.

According to the modification of the seventh embodiment, theconcentration of an electrolyte, the temperature and the voltage areadjusted when acidically oxidizing an aluminum film (not shown), therebyforming the aluminum oxide film 78 having pores 73 arranged in the formof triangular lattices in a self-organized manner as shown in FIG. 35.More specifically, anodic oxidation is performed under conditions of anelectrolyte concentration of about 0.3 mol (oxalic acid), a temperatureof about 1° C. and a voltage of 40 V. The aluminum oxide film 78 is anexample of the “metal oxide film” in the present invention.

According to the modification of the seventh embodiment, rectilineargroove patterns are formed through a step similar to that according tothe aforementioned seventh embodiment. As shown in FIGS. 36 and 37, masklayers 54 are periodically formed on the aluminum oxide film 78.Thereafter the pores 73 are enlarged by wet etching, therebysubstantially completely removing portions of the aluminum oxide film 78located on regions formed with grooves 78 a as shown in FIGS. 38 and 39.Thus, the aluminum oxide film 78 is formed with rectilinear gratinggroove patterns. The grating groove patterns include the grooves 78 aformed by coupling the pores 73 with each other as a belt. The grooves78 a of the grating groove patterns are uniformly formed along the depthdirection to reach the transparent substrate 51.

According to the modification of the seventh embodiment, oxidation isperformed under specific conditions adjusting the electrolyteconcentration, the temperature and the voltage as hereinabove described,whereby the pores 73 can be formed in regular positions of the aluminumoxide film 78 for improving the dimensional accuracy of the grooves 78 aformed by coupling the pores 73 with each other as a belt. Thus, a waveplate having a desired birefringence property can be easily prepared.

Although the present invention has been described and illustrated indetail, it is clearly understood that the same is by way of illustrationand example only and is not to be taken by way of limitation, the spiritand-scope of the present invention being limited only by the terms ofthe appended claims.

For example, while the present invention is applied to formation of anoptical element such as a polarization element or apolarization-dependent diffraction element in each of the aforementionedembodiments, the present invention is not restricted to this but is alsoapplicable to formation of an element, having grating groove patterns,other than the optical element.

While the present invention is applied to formation of a wave plateserving as a polarization element or a polarization-dependentdiffraction grating serving as a polarization-dependent diffractionelement in each of the aforementioned first to seventh embodiments, thepresent invention is not restricted to this but is also applicable toformation of a polarization element, a polarization-dependentdiffraction element or a multilayer film element other than a wave plateor a polarization-dependent diffraction grating. For example, apolarized beam splitter or an isolator is conceivable as a polarizationelement other than a wave plate. On the other hand, a holographicoptical element (HOE) or a Fresnel lens is conceivable as apolarization-dependent diffraction element other than apolarization-dependent diffraction grating. As a multilayer film elementutilizing. Bragg reflection or a waveguide multilayer film element, awaveguide filter (see FIG. 40), a reflector, a branching filter or aguided mode converter is conceivable.

FIG. 40 shows the structure of a waveguide filter serving as theaforementioned multilayer film element. Referring to FIG. 40, a metaloxide film 98 having rectilinear grating groove patterns 99 according tothe present invention is formed on a prescribed region of a substrate91. The grating groove patterns 99 are arranged in the vicinity of thecentral portion of the metal oxide film 98, and serve as a filter part90 a. Regions of the metal oxide film 98 other than the filter part 90 aserve as waveguides 90 b. When guiding light A and light B having twotypes of wavelengths, the light A having a wavelength not satisfyingBragg reflection is transmitted through the filter part 90 a, while thelight B having a wavelength satisfying Bragg reflection is reflected bythe filter part 90 a. The grating groove patterns 99 serving as thefilter part 90 a may be formed to gradually change the pitch of grooves99 a as shown in FIG. 41, grooves 99 b may be formed to radially extendas shown in FIG. 42, or grooves 99 c may be arcuately formed as shown inFIG. 43. The arcuate grooves 99 c shown in FIG. 43 can be formed througha process similar to those according to the aforementioned first tothird, sixth and seventh embodiments.

The aforementioned polarization element, polarization-dependentdiffraction element or multilayer film element may be formed withgrating groove patterns having two-dimensionally (planarly) intersectinggrooves 99 d, as shown in FIG. 44.

While the aluminum film 3, 13, 23, 33 or 53 is anodically oxidized ineach of the aforementioned first to seventh embodiments, the presentinvention is not restricted to this but a film of another valve metalsuch as titanium or tantalum may alternatively be anodically oxidized.

While the electrolyte employed for anodic oxidation is prepared fromsulfuric acid or oxalic acid in each of the aforementioned first toseventh embodiments, the present invention is not restricted to this butthe electrolyte may alternatively be prepared from phosphoric acid orthe like.

While the cathode 6 or 36 employed for anodic oxidation is prepared fromplatinum in each of the aforementioned first to seventh embodiments, thepresent invention is not restricted to this but the cathode 6 or 36 mayalternatively be prepared from another material.

While no transparent electrode film is formed between the transparentsubstrate 51 and the aluminum film 53 in each of the aforementionedsixth and seventh embodiments, the present invention is not restrictedto this but a transparent electrode film may alternatively be formedbetween the transparent substrate 51 and the aluminum film 53 forapplying a voltage to the aluminum film 53 through the transparentelectrode film in oxidation. In this case, the voltage can be regularlyapplied to the aluminum film 53 during oxidation, whereby the aluminumfilm 53 can be prevented from disadvantageously leaving unoxidizedportions also when the transparent substrate 51 has an irregularsurface.

While the mask layers 54 are made of Ni in each of the aforementionedsixth and seventh embodiments, the present invention is not restrictedto this but the mask layers 54 may alternatively consist of a metalother than Ni, an inorganic dielectric material such as SiO₂ orphotoresist. In order to prevent pores located on the regions formedwith the mask layers 54 from etching, the mask layers 54 are preferablyprepared from a material having excellent durability against wetetching. In order to accurately form the etching grooves 50 in theaforementioned sixth embodiment, the mask layers 54 are preferablyprepared from a material having excellent durability against dryetching. For example, Ta, Ti or Cr is conceivable as the material havingexcellent durability against dry etching.

While the mask layers 54 are periodically formed on the aluminum film 53by the lift-off method in each of the aforementioned sixth and seventhembodiments, the present invention is not restricted to this but themask layers 54 may alternatively be periodically formed on the aluminumfilm 53 by depositing a material for forming the mask layers 54 on theoverall surface of the aluminum film 53 and thereafter forming isolationtrenches with a focused ion beam (FIB).

While the etching grooves 50 are formed in the anodic oxidation step inthe aforementioned sixth embodiment for improving accuracy of thepositions for forming the pores 53 a and 53 b, the present invention isnot restricted to this but the etching grooves 50 may not be formed.

While the aluminum oxide film 68 having the pores 63 arranged in theform of triangular lattices is formed in a self-organized manner byperforming oxidation under specific conditions adjusting the electrolyteconcentration, the temperature and the voltage in the aforementionedseventh embodiment, the present invention is not restricted to this butthe aluminum oxide film 68 having the pores 63 arranged in the form oftriangular lattices may alternatively be formed in a self-organizedmanner by performing oxidation after texturing.

Further, a step of annealing the aluminum film may be added beforeanodic oxidation, as reported in relation to conventional anodicoxidation of a bulk aluminum substrate. In this case, the positions ofthe micropores 63 can be more accurately controlled.

A molding prepared from a mold of the microstructure prepared accordingto the present invention also has equivalent element characteristics.

1-6. (canceled)
 7. A method of manufacturing an element having a microstructure, comprising steps of: forming a metal layer on a substrate; periodically forming mask layers on the surface of said metal layer; and anodically oxidizing the surface of said metal layer formed with said mask layers while opposing this surface to a cathode surface thereby forming a metal oxide film having a linear grating groove pattern.
 8. The method of manufacturing an element having a microstructure according to claim 7, wherein said step of forming said metal oxide film having said grating groove pattern includes a step of anodically oxidizing the surface of said metal layer formed with said mask layers while opposing this surface with said cathode surface thereby forming micropores on the surface of said metal oxide film formed with no said mask layer and thereafter enlarging said micropores by etching thereby forming said metal oxide film having said grating groove pattern.
 9. The method of manufacturing an element having a microstructure according to claim 7, further comprising a step of etching said metal layer through masks of said mask layers thereby forming etching grooves in advance of said step of forming said metal oxide film having said grating groove pattern.
 10. The method of manufacturing an element having a microstructure according to claim 9, setting the width of said etching grooves and the width of said mask layers to satisfy a relational expression L≠2S assuming that S represents the width of said etching grooves and L represents the width of said mask layers respectively.
 11. The method of manufacturing an element having a microstructure according to claim 7, further comprising a step of forming a transparent conductor film on said substrate in advance of said step of forming said metal layer on said substrate.
 12. The method of manufacturing an element having a microstructure according to claim 7, wherein said step of forming said metal oxide film having said linear grating groove pattern includes a step of forming said metal oxide film having rectilinear said grating groove pattern.
 13. The method of manufacturing an element having a microstructure according to claim 7, wherein said step of forming said metal oxide film having said linear grating groove pattern includes a step of forming said metal oxide film having curvilinear said grating groove pattern.
 14. A method of manufacturing an element having a microstructure, comprising steps of: forming a metal layer on a substrate; anodically oxidizing the surface of said metal layer while opposing this surface to a cathode surface thereby forming a metal oxide film having micropores; periodically forming mask layers on the surface of said metal oxide film; and enlarging said micropores in a region formed with no said mask layer through masks of said mask layers by etching thereby forming a metal oxide film having a linear grating groove pattern.
 15. The method of manufacturing an element having a microstructure according to claim 14, wherein said step of forming said metal oxide film having micropores includes a step of forming said metal oxide film having micropores arranged in the form of a triangular lattice.
 16. The method of manufacturing an element having a microstructure according to claim 14, further comprising a step of forming a transparent conductor film on said substrate in advance of said step of forming said metal layer on said substrate.
 17. The method of manufacturing an element having a microstructure according to claim 14, wherein said step of forming said metal oxide film having said linear grating groove pattern includes a step of forming said metal oxide film having rectilinear said grating groove pattern.
 18. The method of manufacturing an element having a microstructure according to claim 14, wherein said step of forming said metal oxide film having said linear grating groove pattern includes a step of forming said metal oxide film having curvilinear said grating groove pattern. 19-28. (canceled) 